CD Image of a Dual Contact

Atomic Force Microscopy Webinar:

Applications in High Volume Semiconductor Manufacturing

In-line AFM metrology provides critical information for advanced process control and process development. In this webinar, we will explore this unique and critical role played by AFM and AFP. Topics to be covered will be Front End of Line (FEOL) applications such as STI etch, divot and CMP metrology; gate metrology including stress liners and novel FET structures; Back End of Line (BEOL) contact and via metrology and copper dishing and erosion. Techniques that will be covered in this webinar will include depth and CD metrology, profiling and full 3D die mapping.

Join our Nanoscale World Community, meet with our presenter, Applications Scientist, Sean Hand, and follow all of our events.

This broadcast will include a fully-interactive Q&A sessions to answer all your questions and share your ideas. There will be only one broadcast, so be sure to register early to reserve your seat.

Wednesday, April 20, 2011 8:30 AM - 9:30 AM PST

• Enabling Higher AFM Productivity

• High Volume Semiconductor Manufacturing

• Survey, Screening and Dynamics

Live Morning Broadcast

Wednesday, April 20, 2011 8:30 AM - 9:30 AM PST

Bruker Nanoscale World Community

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Sincerely,

Your Nano Surfaces AFM Webinar Team

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